XENPAK-SX-MM850

No. Parte OEM: XENPAK-SX-MM850
No. Parte FK: XENPAK-SX-MM850-FK

H3C 10GBASE-SR XENPAK Module, Multi-Mode (850nm, 300m, LC)

Categorías: ,

Descripción

Specifications

  • Part Number: XENPAK-SX-MM850
  • Device Type: H3C XENPAK
  • Package: XENPAK
  • Data Rate: 10.3Gbps
  • Wavelength: 850nm
  • Distance/Power Budget: 300m
  • Optical Components
    • LD: VCSEL
    • PD: PIN
  • Output Power: -6~-1dBm
  • Receiver Sensitivity: -10dBm
  • Power Supply Voltage: 1.2V/3.3V
  • Connector: Dual SC
  • Fiber Type: MMF
  • Operating Temperature: 0~70 °C
  • DDMI: With
  • Application: Ethernet/10G FC
  • Compatiblity: 100% H3C Compatible

The XENPAK-SX-MM850 is a Class 1 laser product. It fully complies with the multi-sourcing agreement (MSA) which enables it to work in all MSA compliant platforms. The XENPAK-SX-MM850 must be operatred within the specified temperature and voltage limits. The optical ports of the module shall be terminated with an optical connector or with a dust plug.